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DTSTAMP:20260422T000713Z
LOCATION:201-203
DTSTART;TZID=America/Denver:20231117T083000
DTEND;TZID=America/Denver:20231117T100000
UID:submissions.supercomputing.org_SC23_sess195_pan121@linklings.com
SUMMARY:Immersion Cooling:  3 Considerations You Should Care about and Rea
 l-World Deployment Experiences
DESCRIPTION:Dan Olds (Intersect360), Phil Pokorny (Penguin Solutions), JD 
 Enright (TMGcore), Cameron Cross (Shell), Daniel Pope (Submer), and Curt W
 allace (Green Revolution Cooling)\n\nAs the world increasingly relies on a
  new era of high-wattage CPU and GPU platforms to deliver HPC and AI break
 throughs, deploying and cooling these systems within traditional data cent
 ers presents a problem. This panel will discuss the need to create more su
 stainable deployment environments and how immersion cooling is a critical 
 piece to this puzzle.\n\nJoin expert panelists in a discussion about the f
 ollowing three considerations: 1) Cost, 2) Available Options, and 3) Servi
 ce/Support/Warranty Implications. The panel will discuss why out with the 
 old (cooling with fans) and in with the immersive (immersing HPC and AI se
 rvers into high-tech non-conductive fluid) is a sustainable option for the
  future of modern data centers. Most people can agree on one thing – drivi
 ng rack density and cooling of high-wattage processors presents a new set 
 of challenges. The good news? We have options! Join our SC23 panel to lear
 n more.\n\nTag: Artificial Intelligence/Machine Learning, Energy Efficienc
 y, Hardware Technologies\n\nRegistration Category: Tech Program Reg Pass, 
 Workshop Reg Pass, Tutorial Reg Pass, Exhibits Reg Pass\n\nSession Chair: 
 Daniel Olds (Olds Research)\n\n
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